发明名称 POROUS MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a porous dielectric material of low permitivity useful in electronic component industry and a method of manufacturing it. SOLUTION: The method of manufacturing a porous dielectric material comprises following steps: a) disperse removable polymeric porogen into a dielectric material of the B-step b) harden the B-step dielectric material to form a dielectric matrix material without substantially dissolving porogen c) obtain a porous dielectric material, substantially soluble with the B-step dielectric material, including a step to remove porogen at least partially for providing favorable condition to form a porous dielectric material without dissolving the dielectric matrix material actually the dielectric material.
申请公布号 JP2001210142(A) 申请公布日期 2001.08.03
申请号 JP20000302537 申请日期 2000.10.02
申请人 SHIPLEY CO LLC 发明人 ALLEN CRAIG S;NIKOI ANAN;BLANKENSHIP ROBERT M;GALLAGHER MICHAEL K;GORE ROBERT H;LAMOLA ANGELO A;YOU YUJIAN
分类号 C08J9/26;H01B3/46;H01L21/312;H01L21/768;H01L23/522;H05K1/03;H05K3/00;(IPC1-7):H01B3/46 主分类号 C08J9/26
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