| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor package free of voids (bubble-induced unfilled part with bonding resin) by ventilating a mounting board for rein injection. SOLUTION: In a semiconductor package, where a semiconductor element 10 is mounted on a mounting board 11 via solder bumps 12, the mounting board 11 is provided with an exhaust port 11a almost in the center to load the semiconductor element 10, and the semiconductor element 10 is sealed with resin supplied from the periphery of the semiconductor element 10 by print coating.
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