发明名称 |
Semiconductor element-mounting board and semiconductor device |
摘要 |
Conductive members formed of metallic wires constructed so that they extend linearly between a semiconductor element-mounting face and a circuit board-mounting face of a base member are integrally molded with the base member. For this purpose, a resin material for forming the base member is injected into a mold wherein the conductive members are linearly arranged beforehand.
|
申请公布号 |
US6265673(B1) |
申请公布日期 |
2001.07.24 |
申请号 |
US19970890009 |
申请日期 |
1997.07.08 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
HIGASHIDA TAKAAKI;KUMAGAI KOICHI;MATSUO TAKAHIRO |
分类号 |
H01L21/60;H01L21/48;H01L23/12;H01L23/498;H01L23/52;H05K1/18;(IPC1-7):H05K1/16 |
主分类号 |
H01L21/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|