| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit substrate which can hold dimensional accuracy of a conductor circuit in a manufacturing step and can be readily multilayered. SOLUTION: This method has a first step in which there are prepared a circuit substrate 40, in which a first insulation layer 301 and a first conductor circuit 201 composed of a polyimide-based resin, are formed in this order on a support body 1 made of a high rigid metal, and a copper foil 22 forming a bump electrode 22a as a conductive path, and the circuit substrate 40 and a the copper foil 22 are stacked via a second insulation layer 302 made of a polyimide-based resin. A first conductor circuit 201 is brought into contact with the bump electrode 22a. The method has a second step in which the first conductor circuit 201 is electrically connected to the bump electrode 22a through ultrasonic vibrations, and a third step in which the copper foil 22 is wired to form a second conductor circuit 202. |
