| 摘要 |
PURPOSE: To form a compact, inexpensive device with a condenser lens by equipping a semiconductor element that is electrically connected to the outside by directly and electrically making connection to the lower surface of a wiring pattern with an opening for condensation. CONSTITUTION: The semiconductor device is composed of an electrode 3 on a semiconductor element 2 that is electrically connected to a wiring pattern 11 being directly formed on the reverse side of a condenser lens 1, a resist 12 for protecting the wining pattern 11, a sealing material 13 for sealing the connection between the electrode 3 and the wiring pattern 11, and an external terminal 5 that is connected to the wiring pattern 11. Then, the wiring pattern 11 is provided on the reverse side of the condenser lens 11, an opening corresponding to the light reception part of the semiconductor element 2 is provided at the wiring pattern 11, and the semiconductor element 2 is directly connected to the wiring pattern 11, thus resulting in a different configuration. Therefore, for directly forming the wiring pattern, no package substrate is provided and costs can be reduced, thus obtaining a compact semiconductor device closest to the effective region of the lens.
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