MANUFACTURE OF CARD BASE MATERIAL FOR IC CARD

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of card base material for IC card which prevents the twist of a molded part caused at the time of cooling and also is excellent in productivity. SOLUTION: At the time of manufacturing the card base material for IC card in which a flat plate-shaped card base material for IC card where a thin- walled part to be a recessed part 61 for embedding in which an IC module is embedded is manufactured by an injection molding process, a flat plate-shaped molded part 60 formed in a cavity and a spool part 37a elongating almost vertically with respect to the principal plane of the part 60 is cut off in a gate part 38a before performing mold opening of a metallic mold after injecting melted resin into the cavity formed into the metallic mold. Subsequently, the mold opening is performed and the part 60 from which the part 37a is cut off in the part 38a is taken out from the cavity and cooled.