The present invention relates to a flexible substrate transducer assembly that integrates a transducer or a transducer system and a flexible carrier substrate. This integration of the transducer system and a flexible carrier substrate provides an integrated solution that supports cost-effective manufacturing of the flexible substrate transducer assembly by using standard components and proven manufacturing technologies. The present invention is particularly well suited for use in compact electronic equipment such as mobile phones and hearing instruments that will benefit from the small outer dimensions obtainable by the flexible substrate transducer assembly according to the present invention.
