APPARATUS FOR MONITORING A SOLDER WAVE

摘要

There is disclosed apparatus for monitoring a solder wave comprising a board of insulating material simulating a printed circuit board, an array of spaced electrical contact elements on the underside of the board across the entire width thereof, means for measuring the dwell time of each contact in the wave as the board is conveyed over the wave, and means for displaying the measured dwell times to show the contact area and time.