| 摘要 |
PROBLEM TO BE SOLVED: To surely form a protective film over the entire surface of a substrate, related to a film-forming device comprising a substrate holder. SOLUTION: A protective film is formed twice with a film-forming apparatus 2. A wafer W taken out of a substrate holder, after a first film-formation is moved to a rotary device 4 and placed on a turntable 41 for rotation in a horizontal plane by 10 deg.. Then the wafer W is moved to the film-forming device 2, and attached to the substrate holder, while the substrate is retained in a state different from the first one. Under these conditions, a second formation of the protective film is executed.
|
