| 摘要 |
PURPOSE: A wafer transfer device using electrostatic stress is provided to safely transfer a wafer by absorbing and fixing the wafer loaded by a robot arm using electrostatic stress. CONSTITUTION: A wafer transfer device comprises a robot arm(300) on which a wafer(200) is loaded, an electrostatic stress generating part(400) equipped with a top surface of the robot arm(300) and a power supply part suppling a positive potential and a negative potential to the electrostatic stress generating part(400). The electrostatic stress generating part(400) comprises the first, the third and the fifth electrode(410,412,414) being supplied with the positive potential; the second and the fourth electrode(420,422) being supplied with the negative potential; and the first to the fourth dielectric(430,432, 434,436) each disposed between the first and the second electrode(410,420), the second and the third electrode(420,412), the third and the fourth electrode(412,422) and the fourth and the fifth electrode(422,414). An electric field is generated from the first, the third and the fifth electrode(410,412,414) toward the second and the fourth electrode(420,422) when the wafer is loaded on the robot arm(300) and a power source is added to the first through the fifth electrode(410,420,412,422,414).
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