发明名称 Method of constructing a fuse for a semiconductor device and circuit using same
摘要 A method for providing a fuse apparatus for a semiconductor device includes providing at least one fuse portion of the fuse apparatus with at least two fuses connected in series. A circuit, such as a redundancy decoder, is adapted to utilize a fuse apparatus including at least one fuse portion having a plurality of fuses connected in series. The fuse apparatus is preferably provided with polysilicon fuses which are cut using a laser beam cutting device. The fuse apparatus provides an increased probability of accurately cutting a fuse portion of a fuse means necessary to effect a proper repair of the circuit and to improve the semiconductor circuit operational reliability.
申请公布号 US6198338(B1) 申请公布日期 2001.03.06
申请号 US19980161228 申请日期 1998.09.28
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HAN EUI-GYU;KIM EUN-HAN;KIM YOUNG-GUN
分类号 G11C17/16;(IPC1-7):H01H37/76 主分类号 G11C17/16
代理机构 代理人
主权项
地址
您可能感兴趣的专利