MANUFACTURE OF PRESSURE SENSOR

摘要

PROBLEM TO BE SOLVED: To realize a method for surely avoiding the intrusion of molding material through a gap. SOLUTION: Means for cutting a pressure supply part 28 of a semiconductor pressure pickup 2 from a coating of molding material has a plunger 43 disposed while being spaced apart from the plane 20 of the pickup 2 on the side opposite to an assembling section 12 by a gap 45 in an injection molder 40. Fluidity of molding material is reduced in the region of the plunger 43 by varying the temperature thereof with respect to the temperature of liquefied molding material thus blocking at least complete intrusion of molding material into the gap 45.