发明名称 PLASMA TREATING SYSTEM AND PLASMA TREATING METHOD
摘要 PROBLEM TO BE SOLVED: To reduce the thermal damage of the object to be treated by providing a cooling means for cooling the object to be treated in the process of plasma treatment. SOLUTION: A cooling means 50 is formed of a work stand 51 formed of a circular pipe with approximately circular cross-sections such as a stainless steel pipe and a refrigerant flowing through a flow passage 61 at the inside of the work stand 51. The work stand 51 is arranged long approximately horizontally on the lower side of a blow-off port 21 of a plasma treating device A, the approximately half part on the upper side of the outer face of the work stand 51 is formed as a contact part 52 for being brought into contact with the lower face of the object 5 to be treated, and the lower side of the work stand 51 is arranged with a ruturn pipe 54 similar to the work stand 51 approximately parallel to the work stand 51. One end of the return pipe 54 is directly connected with one end of the work stand 51, and moreover, the other end of the return pipe 54 is connected with the other end of the work stand 51 via a pump 55. By this pump 55, the refrigerant is flowed and circulated through the flow passages 61 of the work stand 51 and the return pipe 54, the work stand 51 is cooled by the refrigerant, and the object 7 to be treated in contact with the contact part 52 can be cooled.
申请公布号 JP2001049470(A) 申请公布日期 2001.02.20
申请号 JP19990230801 申请日期 1999.08.17
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 NAKAMURA KOSUKE;SAWADA KOJI;TAGUCHI NORIYUKI;YASUDA MASAHARU;YAMAZAKI KEIICHI;KITAYAMA KAZUYA;NAKAZONO YOSHIYUKI
分类号 H05H1/24;C23C16/513;C23F4/00;C23G5/00 主分类号 H05H1/24
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