ASSEMBLY FOR WAFER HANDLING APPARATUS

摘要

PROBLEM TO BE SOLVED: To obtain an opening array of a blade which greatly reduces the thermal gradient growing in a high temp. wafer. SOLUTION: A blade assembly 24 for mechanical wafer handlers comprises a thin and long plane member having a center region having a first and second opening arrays. The openings of the first array extend along the length of the plane member and are disposed approximately symmetrically to the openings of the second array against the lengthwise center axis passing the center point of the center region. The openings of the first array extend along the width of the plane member and are disposed approximately symmetrically to the vertical axis passing the center point of the center region. The openings of the second array are disposed approximately symmetrically to the vertical axis. The assembly 24 comprises a wrist 26 having a wrist upper cap and a wrist lower cap.