发明名称 LASER PROCESSING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To prevent occurrence of burning at an edge portion and its vicinity when cut processing is applied to a workpiece. SOLUTION: A nozzle 2 is mounted on the downward side in a processing head 1. The nozzle 2 comprises an inside nozzle 2A and an outside nozzle 2B. An inner part of the inside nozzle 2A is used as a first supplying passage 4, and a spacing part between the inside nozzle 2A and the outside nozzle 2B is used as a second supplying passage 5. When laser beams are radiated from the processing head 1 to a workpiece 3 for applying cut processing, assist gas is supplied to the workpiece 3 only via the first supplying passage 4 at edge portions of a cutting line and its vicinity. At the processing portion such as a straight line portion except for the edge portions, the assist gas is supplied to the workpiece 3 via the first supplying passage 4 and the second supplying passage 5.</p>
申请公布号 JP2001009582(A) 申请公布日期 2001.01.16
申请号 JP19990185884 申请日期 1999.06.30
申请人 SHIBUYA KOGYO CO LTD 发明人 NAKAMURA SEIICHI
分类号 B23K26/06;B23K26/14;(IPC1-7):B23K26/06 主分类号 B23K26/06
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