| 摘要 |
PROBLEM TO BE SOLVED: To prevent thermal influence on a board of a burn-in board and on soldered parts thereof. SOLUTION: This burn-in device has a burn-in board 1 and a cooling mechanism 2. The burn-in board 1 is a hollow box body and has a circuit board 3. A plurality of sockets 5 for mounting semiconductor devices 4 are provided on an outer surface of the circuit board 3 while circuit components 6, etc., of the semiconductor devices 4 to be tested are mounted on an inner surface thereof. The outer surface of the circuit board 3 excluding portions mounted with the sockets 5 is covered by a heat insulating material 7. The burn-in board 1 has an air inlet port 8 in one end of the hollow box body and an exhaust port 9 in the other end, thus forming a cooling-air flowing path within the box body. The cooling mechanism 2 sends cooling air through the air inlet port 8 into the flowing path in the burn-in board 1, causes the cooling air to flow along the circuit board 3 and the circuit components 6, causes it to flow out from the exhaust port 9, thus forcedly cooling the circuit board 3, the circuit components 6, and soldered portions.
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