| 摘要 |
PROBLEM TO BE SOLVED: To uniformly heat an electronic component by coupling a heater unit having a heating face for melting solder sticking to the underside of the electronic component with a hanging means by a force smaller than the gravitational force on the weight of the heater unit so that the heater unit can freely oscillate, and positioning the heater unit so that it is in parallel with the top face of the electronic component. SOLUTION: A hanging means 16 provided on a movable plate 10 is formed by winding a constant force spiral spring 16b on a pulley 16a. A rod 13d is protruded from the top face of a heater block 13 at the center of the top face, and is inserted into a through hole 12a with play with the tip of the inserted rod coupled with the tip of a constant force spiral spring 16b through a ring 16c. A heater unit H is hung so that almost all of its own weight is canceled out by tensile strength from the constant force spiral spring. As the result, the heater unit acts to exert as light pressing force as the weight of a heating block 14 and can freely oscillate. Therefore, planar contact is ensured even if the top face of a semiconductor chip 2 is inclined.
|
