发明名称 |
Polishing head for a chemical mechanical polishing apparatus |
摘要 |
A polishing head for a chemical mechanical polishing (CMP) apparatus. The polishing head includes a backplate, a retaining ring supported by the backplate, and a bladder member encircled by the retaining ring. The backplate of the polishing head comprises a driving plate biasedly coupled to a subcarrier by a bellows. The polishing head may further include a lift plate disposed on the subcarrier and beneath the bladder member. A method for polishing a substrate includes placing a substrate on the bladder member and positioning the substrate against a polishing pad such that the bladder member applies a selected pressure profile on the substrate.
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申请公布号 |
US6159083(A) |
申请公布日期 |
2000.12.12 |
申请号 |
US19980116160 |
申请日期 |
1998.07.15 |
申请人 |
APLEX, INC. |
发明人 |
APPEL, GREGORY A.;REGAN, CHARLES J.;WELDON, DAVID E.;CHANG, SHOU-SUNG;LEE, GREGORY C. |
分类号 |
B24B37/04;B24B41/06;(IPC1-7):B24B7/22 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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