发明名称 Polishing head for a chemical mechanical polishing apparatus
摘要 A polishing head for a chemical mechanical polishing (CMP) apparatus. The polishing head includes a backplate, a retaining ring supported by the backplate, and a bladder member encircled by the retaining ring. The backplate of the polishing head comprises a driving plate biasedly coupled to a subcarrier by a bellows. The polishing head may further include a lift plate disposed on the subcarrier and beneath the bladder member. A method for polishing a substrate includes placing a substrate on the bladder member and positioning the substrate against a polishing pad such that the bladder member applies a selected pressure profile on the substrate.
申请公布号 US6159083(A) 申请公布日期 2000.12.12
申请号 US19980116160 申请日期 1998.07.15
申请人 APLEX, INC. 发明人 APPEL, GREGORY A.;REGAN, CHARLES J.;WELDON, DAVID E.;CHANG, SHOU-SUNG;LEE, GREGORY C.
分类号 B24B37/04;B24B41/06;(IPC1-7):B24B7/22 主分类号 B24B37/04
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