发明名称 Positive photoresist composition for exposure to far ultraviolet light
摘要 A positive photoresist composition position for exposure to far ultraviolet light, which comprises a resin decomposing by the action of an acid to increase its solubility in an alkali, and a compound generating an acid by irradiation with an actinic ray or radiation; with the resin comprising repeating units having particular structures, including particular alicyclic structures, and groups decomposing by the action of an acid.
申请公布号 US6159655(A) 申请公布日期 2000.12.12
申请号 US19990264036 申请日期 1999.03.08
申请人 FUJI PHOTO FILM CO., LTD. 发明人 SATO, KENICHIRO
分类号 C08F222/10;C08F232/00;G03F7/004;G03F7/039;H01L21/027;(IPC1-7):G03C1/73;G03C1/72 主分类号 C08F222/10
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