| 摘要 |
Disclosed is an improved pick and place head construction of a type employed for transporting individual semi-conductor chips and similar articles of manufacture during manufacturing processes, and similar non-manufacturing environments. The disclosed device includes a dual head for engaging the chips as well as improved structure for varying the space between the heads by means of programmable actuators. In one embodiment, the vacuum spindles which reciprocate axially to engage the chips are also capable of axial rotation to enable the engaged chips to be rotated as they are transported to a place location. Also disclosed are improved article engaging members formed of synthetic resinous foam materials to enable effective vacuum engagement of non-planar surfaces. One form provides for simultaneous static dissipation.
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