发明名称 Housing for surface mountable device packages
摘要 The terminal contact beams of a test or burn-in socket are provided with an abrasive surface to remove oxides or other films from the contact pins, lands, etc., of an electronic device package. The burn-in or test socket is in the form of a housing which holds the electronic device package by its terminal feet to prevent damage to the device package or mis-alignment of the terminal feet and moves the feet with respect to the terminal contact beams to assure good electrical connection therebetween.
申请公布号 US5729147(A) 申请公布日期 1998.03.17
申请号 US19950517918 申请日期 1995.08.22
申请人 ARIES ELECTRONICS, INC. 发明人 SCHAFF, ROBERT J.
分类号 G01R1/04;(IPC1-7):G01R31/02 主分类号 G01R1/04
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