发明名称 Method of molding a thermally conductive article
摘要 A method of molding a thermally conductive article for transferring heat from a heat generating surface is provided. A mold assembly is first provided which is capable of forming an article of a desired configuration. The initial location of contact on the article with the heat generating surface is then determined. An input gate is formed in the mold assembly at the initial location of contact. The optimum heat flow path through the article is determined. A termination location of the heat flow path is determined. Polymer, loaded with conductive filler, is introduced into the mold assembly via the input gate. Venting is provided in the mold assembly at the termination location of the heat flow path. Polymer is positioned in the mold assembly with the conductive filler being substantially parallel and aligned with the heat flow path. Finally, the molded article is ejected from the mold assembly. With the molding method of the present invention, thermal conductivity of articles may be increased several times over the thermal conductivity realized with conventional molding methods.
申请公布号 US6139783(A) 申请公布日期 2000.10.31
申请号 US19990248798 申请日期 1999.02.12
申请人 CHIP COOLERS, INC. 发明人 MCCULLOUGH, KEVIN A.
分类号 B29C45/00;B29C70/58;(IPC1-7):B29C70/62;B29C67/24 主分类号 B29C45/00
代理机构 代理人
主权项
地址