发明名称 Substrate transferring apparatus
摘要 A substrate transferring apparatus 8 for taking out a semiconductor substrate W to be processed housed in a container 6 from within the container 6 comprises support plates 9 and a positional error correcting member 23 on each support plate. Each support plate 9 has a base portion and is to be inserted into the container 6 to take out the substrate W. The positional error correcting member 23 is provided at the base portion of the support plate 9. The member 23 is to abut a part of the substrate W projecting out of the container 6 and to push back the substrate W into the container 6 when the support plate 9 is inserted into the container 6.
申请公布号 US6132160(A) 申请公布日期 2000.10.17
申请号 US19980102541 申请日期 1998.06.23
申请人 TOKYO ELECTRON LIMITED 发明人 IWAI, HIROYUKI
分类号 B65G49/07;H01L21/22;H01L21/677;(IPC1-7):B65B21/02 主分类号 B65G49/07
代理机构 代理人
主权项
地址