发明名称 EMITTING DIODE PACKAGE
摘要 <p>PURPOSE: An emitting diode package is to improve a brightness by reducing a light scattered from a substrate. CONSTITUTION: An emitting diode package comprises a lead frame(5) with a conical inclined surface(7) formed therein, a solid material(9) filled in a conical region of the lead frame, an emitting diode(8) attached to a constant region of the solid material, a wire electrically connected to an electrode of the emitting diode and the lead frame, and a cap formed on an upper surface of the emitting diode. An interior angle of the con formed in the lead frame is a right angle. The inclined surface is provided with a metal film having a good reflective rate. The solid material has a same reflective rate as that of the substrate.</p>
申请公布号 KR20000055408(A) 申请公布日期 2000.09.05
申请号 KR19990004003 申请日期 1999.02.05
申请人 LG ELECTRONICS INC. 发明人 LEE, SI HYEONG
分类号 H01L33/48;(IPC1-7):H01L33/00;H01L23/48 主分类号 H01L33/48
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