| 摘要 |
PROBLEM TO BE SOLVED: To enable a semiconductor device to be readily handled by absorbing heat stresses generated by heat cycles, which are repeatedly applied to the semiconductor device and a printed wired board having different thermal expansion coefficients from each other and keeping the initial shape of the semiconductor device. SOLUTION: A bump 10 comprises a thermosetting conductive adhesive 10a, which forms an electrically conductive circuit between a semiconductor device 100 and a mother board. The thermosetting conductive adhesive 10a is made into a half-cured state, therein by applying a heating process of a given temperature to a pasty thermosetting conductive adhesive formed on the semiconductor device 100 and the mother board. |
