| 摘要 |
PROBLEM TO BE SOLVED: To evaluate a characteristic of a mounted semiconductor by electrically connecting a probe card base board and a head part, to which a probe pin is fixed, via a BGA package for flip-chip mounting a measured semiconductor. SOLUTION: A first electrode on the lower face of a probe card base board 1 is arranged in compliance with a soldering ball 16 in a BGA package 13, and the first electrode and the back face of the BGA package 13 are connected together by the soldering ball 16. A second electrode in a head part 2 is also arranged matchingly with a surface electrode in the BGA package 13, and then, both electrodes are fastened by a fixing apparatus 4 so as to be connected together. In this way, using the PGA package 113, to which a semiconductor element is flip-chip mounted, the probe card base board 1 and the head part 2 are electrically connected together, so that designing and manufacture of a conversing base board matching the measured semiconductor element is not required. In addition, a measurement result close to that in actual installation can be provided, because an electric characteristic of the semiconductor element is measured through wiring of the BGA package 13 to which a semiconductor is actually mounted.
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