| 摘要 |
PROBLEM TO BE SOLVED: To make improvable the mounting reliability of a semiconductor package. SOLUTION: A semiconductor package has a package base-material 11 with a formed wiring layer, a thin silicon chip 13 mounted on the package base- material 11 and connected electrically with the wiring layer of the package base-material 11, and a molding resin-layer 15 for sealing the thin silicon chip 13. Further, the semiconductor package has a single-sided molding type structure of forming the molding resin-layer 15 on the principal-surface side of the package base-material 11, and on the rear-surface side of the package base-material 11, solder-balls 16 for mounting connected electrically with the wiring layer of the package base-material 11 are provided. The thickness of the thin silicon chip 13 is set to be not larger than 0.15 mm. |
