| 摘要 |
PURPOSE: A spring port for a power semiconductor module is provided to minimize a thermal stress and at the same time to assure a section area of proper current flow even though reducing a junction area when connecting two materials having a large thermal expansion coefficient difference. CONSTITUTION: The spring port(40) is for buffering stress applied according to a thermal expansion coefficient difference between a semiconductor chip(10) and an electrode port(30). The semiconductor chip is bonded with two heat compensation plates(22,24). The spring port comprises a port connection part(42) soldered to the electrode port, a bent part(44) buffering the stress, and a chip connection part(46) having a concave groove(46a) to reduce a junction area. The chip connection part is bonded on an upper heat compensation plate(22) by a solder(50).
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