发明名称 |
Automated stacking and soldering apparatus for three dimensional stack package devices and manufacturing method thereof |
摘要 |
An automated apparatus for three dimensional stack package devices provides mass production of J-lead type stack packages. The apparatus includes a package loader and a package loader/unloader for loading upper and lower individual packages and for unloading packages which have been stacked and soldered; an indexing system for receiving and aligning the upper and lower individual packages and for transporting the stacked upper and lower packages, an applying unit for applying a solder flux or a solder paste to metal leads of the upper individual packages, first and second transfer tools for transferring the individual packages to the applying unit and to the indexing system; and a heating unit for heating the stacked upper and lower packages so that metal leads of the upper and lower packages are solder jointed.
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申请公布号 |
US6092713(A) |
申请公布日期 |
2000.07.25 |
申请号 |
US19980019202 |
申请日期 |
1998.02.05 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, JAE JUNE |
分类号 |
H05K3/34;B23K3/06;B23K37/047;H01L21/50;H01L21/98;H01L23/48;H01L25/065;H01L25/07;H01L25/10;H01L25/11;H01L25/18;H05K13/04;(IPC1-7):B23K31/00 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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