| 摘要 |
PURPOSE: An improved acidic non-electrolytic nickel plating solution is provide perform acidic non-electrolytic nickel plating effectively even if the surface of copper is processed with catalyst. CONSTITUTION: An acidic non-electrolytic nickel plating solution contains metallic nickel salt, an igniting agent, a stabilizing agent, a pH regulating agent, a buffering agent, an improving agent, and a reducing agent. Nickel sulfate or nickel chloride is used as metallic nickel salt. The igniting agent controls plating speed and prevents plating from being discomposed naturally. Latic acid, malic acid, citric acid, or glycolic acid is used as the igniting agent. The stabilizing agent is used for prevent plating from decomposed naturally. More than one among sulphur compound of thiourea, sodium thiosultate, and mercapto benzo thiazoie, sodium molybate, lead nitrate, and tallum sulfate are used as the stabilizing agent. The pH regulating agent is used for regulating pH of the plating solution. Sodium hydroxide, ammonium hydroxide, or potassium hydroxide is used as the pH regulating agent. The buffering agent is used for preventing change of pH of the regulated plating solution. Acetic acid, adipic acid, succinic acid, or salt thereof is used as the buffering agent.
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