| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductor composition in which a defect such as a void or the like is hard to generate. SOLUTION: This conductor composition is formed in such a way that it is applied to a glass ceramic interlayer wiring board which is fired at 800 to 900 deg.C and whose firing shrinkage percentage is at 10 to 15%, and that a vehicle which is composed mainly of a resin and a solvent and an inorganic component are contained. In this case, an Ag powder whose integration 50% particle size is at 9 to 14μm and whose integration 10% particle size is at 5μm or higher and a glass powder whose softening point is at 700 to 800 deg.C constitute the main part of the inorganic component. The mixing ratio of the Ag powder to the glass powder is set in a range of the Ag powder of 87 to 96 wt.% and in a range of the glass powder of 4 to 13 wt.%. The added content of the Ag powder to the glass powder in the inorganic component is at 95 wt.% or higher. When the conductor component for a via is used, its composition is adjusted in such a way that its firing timing agrees nearly with reference to a ceramic green sheet, and the via of high reliability can be formed. |
