| 摘要 |
<p>PROBLEM TO BE SOLVED: To surely use self alignment due to surface tension of fused solder by mounting a chip resistor on the upper surface of a printed board or the like, in such a manner that both auxiliary electrodes of the chip resistor abuts against both electrode pads, and fusing solder paste. SOLUTION: In this chip resistor, one end portions 12a, 13a of a cover coat 7 side in both auxiliary electrodes 12, 13 are so stacked on the upper surface of the cover coat 7 that the one end portions 12a, 13a of both auxiliary electrodes 12, 13 protrude from the surface of the cover coat 7, or both end portions 7a, 7b of the cover coat 7 are so stacked toward the lower sides of both auxiliary electrodes 12, 13 that the one end portions 12a, 13a of the cover coat 7 side in both auxiliary electrodes 12, 13 protrude from the upper surface of the cover coat 7. Thereby the protruding end portions 12a, 13a abut against a printed board 16 in advance of the upper surface of the cover coat 7 in both auxiliary electrodes 12, 13 and it can be surely avoid that the cover coat 7 comes into contact with the printed board 16 side.</p> |
