| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize an infrared imaging element by a method wherein the infrared imaging element is formed to be of a structure in such a way that it is not soldered directly to the lower-part structure of an airtight container, that it is fixed to the lower-part structure of the airtight container via a thermionic element and that it is lidded with the upper-part structure of the airtight container. SOLUTION: Infrared rays 8 are condensed by a lens system 5 so as to be changed into condensed infrared rays 9, and their image is formed on an infrared imaging element 1. In the imaging element 1, a temperature rise which corresponds to the intensity of the incident infrared rays is generated in a thermosensitive part which is integrated at the inside. The temperature rise changes the electric characteristic of a substance which forms the thermosensitive part. An electric signal which corresponds to a thermal image is obtained. At this time, the texture of the substance forming the thermosensitive part is not homogeneous over the whole region of the thermosensitive part. As a result, an output at a time when the change amount of the electric characteristic with reference to the temperature rise is zero and an output at a time when the incident electric-power amount of infrared rays are not identical, It is required to maintain the temperature of the imaging element 1 to be constant. A temperature sensor 2 and a thermionic element 3 are maintained. On the other hand, the temperature rise of the thermosensitive part can be relaxed by conduction and convection.
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