| 摘要 |
PROBLEM TO BE SOLVED: To make it hard to bring about short circuit due to the deformation of lead wire which is caused by external force applied from a lateral direction when a flat coil is carried and stored in the manufacturing process of an IC card. SOLUTION: After a frame 10 for an IC card in which a flat coil 14 is partially connected to an outer frame 16 is formed by press working, the flat coil, the outer frame and a connecting part 22 that partially connects the flat coil are inserted between two pieces of protection films, the protection films are connected by a 1st adhesive layer formed on one of the protection films, a connecting part connecting the coil 14 and frame 16 is next cut off together with the protection films, after that, one of the protection films is peeled off, the coil 14 connected to the other protection film is transferred to a 2nd adhesive layer which is formed on one surface side of the IC card and has stronger adhesive strength and then, the coil 14 is sealed with resin between the films of both surfaces of the IC card. |
