| 摘要 |
PROBLEM TO BE SOLVED: To largely simplify the production process by reducing the number of processes requiring external force such as deburring, lead cutting, lead forming and so forth. SOLUTION: A semiconductor element 20 is mounted on the inner lead 25 of a lead frame. The inner lead 25 and tie bars 26 are resin-sealed to form a mold 24 so that part of the tie bars 26 are exposed outside. The mold 24 is cut along the side end so that the unnecessary part of the tie bar 26 is cut to form external terminals 29. At the same time, burr of the mold 24 is removed. |
