LEAD FRAME, MANUFACTURE THEREOF AND SEMICONDUCTOR DEVICE USING THE LEAD FRAME

摘要

PROBLEM TO BE SOLVED: To enhance horizontal biting strength to resin and protect elements with respect to mechanical and thermal stresses by forming an element mount and a center lead having the same thickness less than a specified board thickness, and providing a broad part and part bent to the top of the element mount at notches and openings of a depth less than the board thickness. SOLUTION: The lead frame has an element mount 3, a horizontal part 4 and a center lead 5 unified in one body with side leads 6 formed parallel at both sides of the center lead 5. The element mount 3 and the center lead 5 have the same thickness less than a board thickness of 1 mm. Two pairs of opposed inverted trapezoidal notches 1a-1d are formed at other two sides than the side having the element mount 3, horizontal part 4 and center lead 5 and located at approximately equal distances from the element mount 3 center. Approximately inverted trapezoidal notches 2a, 2b are formed at both sides of the center lead 5 on the one side having the center lead 5. This raises the horizontal biting at strength to resin and protects semiconductor elements with respect to mechanical and thermal stresses.