CONDUCTIVE PARTICLES AND METHOD OF IMPLEMENTATION OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To prevent variations in frequency characteristics due to variations in contact resistance of conductive particles which electrically connect between bump electrodes of a semiconductor device and input/output electrodes of a package board. SOLUTION: Particles 4 are conductive particles in the shape of balls plural number of which are diffused in an insulating adhesive resin 3, and electrically connect between semiconductor devices 6 in each of which an integrated circuit is built and on which bump electrodes 7 are formed, and a package board 2 on which input/output electrodes 1 are formed and the semiconductor devices 6 are mounted. In this case, when the semiconductor devices 6 and the package board 2 are pressurized and heated, the particles are pressed and crushed while they are in surface contact with the bump electrodes 7 and the input/output electrodes 1 and then they are hardened in the same state.