| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method in which even electrode pads arranged at fine pitch can be connected surely each other. SOLUTION: A large number of contact holes 11 are made through an insulating sheet 10 by punching and filled with solder paste 12 by screen printing. An insulating sheet 10 is then mounted on a substrate 30 while matching the contact holes 11 with electrode pads 31 and a semiconductor element 20 is mounted thereon while matching the contact holes 11 with electrodes 22. The solder paste 12 is spread into vertical gaps by applying a pressure from above and below. Finally, it is heated entirely at 200-220 deg.C to melt the solder paste 12 by reflow thus connecting both electrode pads 22, 31 electrically through a bump. |
