发明名称 WAFER PACKAGING CONTAINER AND METHOD OF WAFER PACKAGING THEREWITH
摘要 <p>PROBLEM TO BE SOLVED: To package wafers which have a plurality of sizes, with a single container. SOLUTION: A wafer packaging container 10 that packages a plurality of wafers 20 is provided with a cylindrical body 11, which has an opened upper edge and a closed lower edge, and which has an inner diameter larger than the largest outer diameter among the wafers 20 to be packaged, a cap 12 that covers freely at the upper edge of the body 11 to be capable of closing the opening, a stay 13 standing at the center of the bottom of the cylindrical body 11, cushions 14 made of an elastic material and each having a through-hole 15 for the stay 13 to pass through, and protecting sheets 16 each having a through-hole 17 for the stay 13 to pass through. As a result, by inserting the stay standing on the body into a hole opened on each wafer to be packaged, wafers of different sizes can all be packaged in a wafer packaging container of identical standard, and the running cost for the wafer packaging can be reduced by enhancing the interchargeability or general-purposeness of the wafer packaging container.</p>
申请公布号 JP2000049218(A) 申请公布日期 2000.02.18
申请号 JP19980226562 申请日期 1998.07.28
申请人 HITACHI LTD;HITACHI ULSI SYSTEMS CO LTD 发明人 EMATA KOJI;SHIMOISHI TOMOAKI;TSUBOI KAZUYA;SASAKI MASAKO;NUMAZAKI MASAHITO;AZUMA SHUICHIRO;OKINAGA TAKAYUKI;ENOMOTO USUKE
分类号 B65D85/86;H01L21/673;H01L21/68;(IPC1-7):H01L21/68 主分类号 B65D85/86
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