| 摘要 |
PURPOSE: A die-bonding machine is provided to provide compact system and simple control S/W by decreasing the moving range of a pallet loading instrument in relation to the speed of bonding motion. CONSTITUTION: The die-bonding machine comprises: pallets(3) loading instrument which supplied semiconductor pallets are loaded on and freely move in X, Y directions; pickup positions freely moving in horizontal X, Y directions; a pallet carrier having vacuum absorbing nozzle(14) freely moving in X, Y, Z directions, and wherein the semiconductor pallets(3) are supplied in arranged state and are sequentially pickup and carried.
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