发明名称 HEAT DISSIPATION UNIT FOR ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To enhance performance for dissipating heat to the outside of housing. SOLUTION: The heat dissipation unit is built in a notebook-sized personal computer 1 in order to dissipate heat generated from a CPU 5 arranged in a housing 3 to the outside. The heat dissipation unit comprises a horizontal planar heat pipe 7 arranged in the housing 3, and heat dissipation fins 20 fixed to a part of one side of the heat pipe 7. The heat pipe 7 has a container 11 defined by flat upper and lower walls, and a circumferential wall extending along the circumferential edge thereof. Heat dissipation openings 22 are made in the circumferential wall of the housing 3 in the vicinity of the fin 20 while facing the fin 20. A fan 23 passes the air in the housing 3 through the fins 20 and then delivers the air from the opening 22 to the outside of the housing 3.
申请公布号 JP2000022369(A) 申请公布日期 2000.01.21
申请号 JP19980187641 申请日期 1998.07.02
申请人 SHOWA ALUM CORP 发明人 OTA KEIICHIRO;FURUKAWA YUICHI
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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