发明名称 |
HEAT DISSIPATION UNIT FOR ELECTRONIC APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To enhance performance for dissipating heat to the outside of housing. SOLUTION: The heat dissipation unit is built in a notebook-sized personal computer 1 in order to dissipate heat generated from a CPU 5 arranged in a housing 3 to the outside. The heat dissipation unit comprises a horizontal planar heat pipe 7 arranged in the housing 3, and heat dissipation fins 20 fixed to a part of one side of the heat pipe 7. The heat pipe 7 has a container 11 defined by flat upper and lower walls, and a circumferential wall extending along the circumferential edge thereof. Heat dissipation openings 22 are made in the circumferential wall of the housing 3 in the vicinity of the fin 20 while facing the fin 20. A fan 23 passes the air in the housing 3 through the fins 20 and then delivers the air from the opening 22 to the outside of the housing 3.
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申请公布号 |
JP2000022369(A) |
申请公布日期 |
2000.01.21 |
申请号 |
JP19980187641 |
申请日期 |
1998.07.02 |
申请人 |
SHOWA ALUM CORP |
发明人 |
OTA KEIICHIRO;FURUKAWA YUICHI |
分类号 |
H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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