发明名称 LAMINATE FOR LASER PUNCHING AND METHOD THEREOF
摘要 <p>PROBLEM TO BE SOLVED: To enable punching wherein irregularity of hole diameter is little, by setting either a gap between neighboring warp or a gap between neighboring weft in woven fabric to be a length in a specified range. SOLUTION: Woven fabric 10 is formed in a cloth type by weaving a thread formed by bundling many inorganic fibers such as glass and organic fibers such as a polyester, polyamide, polyacryl and polyimide. In this woven fabric 10, either a gap (x) between neighboring warps 12 or a gap (y) between neighboring wefts 14 is set in a range of 0-50μm. The woven fabric 10 wherein either the gap (x) between the warps or the gap (y) between the wefts is 0-50μm is used for a laminate. When a hole 30 is made in the laminate by using a laser beam, the area of a part where the gap (x) between the warps and the gap (y) between the wefts overlap with each other is narrowed, decomposition of cured resin 20 is made hard to expand, and irregularity of the hole diameter can be reduced.</p>
申请公布号 JP2000022302(A) 申请公布日期 2000.01.21
申请号 JP19980183495 申请日期 1998.06.30
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 SAITO EISAKU
分类号 B23K26/00;B23K26/38;H05K1/03;H05K3/00;H05K3/46;(IPC1-7):H05K3/00 主分类号 B23K26/00
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