| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic device and capable of surely forming a desired thin film with excellent evenness, suppressing occurrence of patterning failure, and providing stable quality. SOLUTION: This method for manufacturing an electronic device includes a coating process of applying a photosensitive or non-photosensitive resin to a substrate 1 by employing a manner of dripping the resin through a slit to the substrate 1. While the scanning direction of the slit type dripping nozzle 2 for dripping the resin being kept inclined in relation to the substrate 1 after drip coating at a prescribed angleθto the same direction as the rotary direction S of the substrate rotation.
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