发明名称 |
Heat sink device for electronic devices |
摘要 |
<p>A heat sink device for use in an electronic device for dissipating into the atmosphere outside a housing of the electronic device the heat generated by an electronic component disposed within the housing. The housing has a peripheral wall formed with a heat removal opening. A heat sink disposed within the housing comprises a metal body having a heat pipe portion, and a radiation fin attached to the body in the vicinity of the heat removal opening and opposed to the opening. The heat-generating electronic component, such as CPU, is held in contact with the metal body at a location away from the fin attached portion thereof. <IMAGE></p> |
申请公布号 |
EP0969354(A2) |
申请公布日期 |
2000.01.05 |
申请号 |
EP19990112514 |
申请日期 |
1999.07.01 |
申请人 |
SHOWA ALUMINUM CORPORATION |
发明人 |
OHTA, KEIICHIRO;FURUKAWA, YUICHI |
分类号 |
H05K7/20;G06F1/20;(IPC1-7):G06F1/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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