| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing apparatus capable of performing processing at an edge of a wafer with high accuracy, and a wafer processing method.SOLUTION: A position of an outer peripheral part of a wafer W that is rotated by a spin chuck 25 and a position of a process liquid nozzle 210 are detected by a position detection unit 300. An amplitude of a temporal change in the position of the outer peripheral part of the wafer W that is detected during the rotation of the wafer W is acquired as a first amplitude. In a direction that passes a rotation center of the spin chuck 25 and is in parallel with the rotating wafer W, a position of the process liquid nozzle 210 relative to the spin chuck 25 is cyclically changed by a position adjustment part 241 in a frequency that is equal to a rotation frequency of tthe spin chuck 25 and with the first amplitude. A difference between a phase of the temporal change in the position of the process liquid nozzle 210 and a phase of the temporal change in the position of the outer peripheral part of the wafer W is made equal to or less than a predetermined value by the position adjustment part 241. A process liquid is then discharged from the process liquid nozzle 210 to the edge of the rotating wafer W.SELECTED DRAWING: Figure 3 |
