发明名称 SUBSTRATE PROCESSING APPARATUS AND METHOD THEREFOR
摘要 <p>PROBLEM TO BE SOLVED: To rotate a substrate, such as a silicon wafer in a noncontact condition at a high speed. SOLUTION: A wafer 11 is positioned in an opening 18 which passes through the central part of a holder unit 9, so that the wafer 11 is gripped at its edge. Embedded in the holder unit 5 is a magnet 27. A unit supporting/rotating device 5 includes a thrust support coil 29, a radial support coil 31 and stator coil 33. By utilizing the magnetic forces of the coils, the unit supporting/rotating device 5 supports and rotates the holder unit 9 in a noncontacted condition. Since the coils are disposed close to the holder unit 9, the holder unit 9 can be stably supported and be rotated at a high speed. Furthermore, since the wafer 11 is exposed on its upper and lower sides, treatment fluid can be supplied from a nozzle onto the both surfaces of the wafer 11.</p>
申请公布号 JPH11354617(A) 申请公布日期 1999.12.24
申请号 JP19980161607 申请日期 1998.06.10
申请人 SUMIERE SEZ KK 发明人 NAGASAKA MICHIO;MATSUZAWA MINORU;YOSHINO KIYOHIRO
分类号 H01L21/683;H01L21/027;H01L21/304;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/683
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