Unterfüllmaterial für Flip-Chip-bestückte Leiterplatten, damit ausgerüstete Leiterplatte sowie Verfahren zur Füllgradüberprüfung von damit unterfüllten Chips

摘要

The invention relates to a method for verifying the distribution and the filling ratio of underfilling materials by means of X-ray inspection, for example, to detect how they are mounted between the chip and the substrate during or after the soldering of chips on a substrate. Said substrate is provided for mechanical support and for supporting the solder bumps. According to the invention, an auxiliary substance or filling substance which absorbs X-rays is incorporated in the underfilling material. The invention makes it possible to reliably test such underfilling stabilizations also during a running production process for fitted printed circuit boards.