| 摘要 |
PROBLEM TO BE SOLVED: To prevent a card bending stress or pressurizing force from being directly added to the mounting part of an IC chip by mounting an IC chip on a board made of a flexible material, and connecting this flexible wiring board with a wiring board on the rear face side of a connection terminal board. SOLUTION: In the IC module, a wiring pattern 11 is formed on the surface of a flexible board 10, and an IC chip 5 is connected through wire bonding 6 with this. The periphery is covered with an insulator for resin mold so that a resin mold part 4 can be formed. In the IC module in which the IC chip 5 is mounted on the flexible wiring board, a wiring board 7 formed on the rear face side of a connection terminal board 8 and a wiring pattern 11 formed on the flexible board 10 are connected through wire bonding, solder bump, or connecting materials such as anisotropic conductive materials with each other. |
