首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
摘要
申请公布号
JP2909904(B2)
申请公布日期
1999.06.23
申请号
JP19930101769
申请日期
1993.03.22
申请人
YOSHIZAWA SHIN
发明人
YOSHIZAWA SHIN
分类号
A47K5/03;(IPC1-7):A47K5/03
主分类号
A47K5/03
代理机构
代理人
主权项
地址
您可能感兴趣的专利
TRANSPARENT ELECTRODE, ELECTRONIC DEVICE, AND ORGANIC ELECTROLUMINESCENT DEVICE
PHOTOELECTRIC CONVERSION DEVICE, SOLID-STATE IMAGE PICKUP UNIT, AND ELECTRONIC APPARATUS
HOLE-TRANSPORTING MATERIAL FOR INORGANIC/ORGANIC HYBRID PEROVSKITE SOLAR CELLS
LIGHTING DEVICE
VARIABLE RANGE PHOTODETECTOR AND METHOD THEREOF
METHOD FOR QUICK SELF INTERCONNECTION OF PHOTOVOLTAIC CELL ARRAYS AND PANELS
SOLAR ENERGY APPARATUS AND METHOD
THERMALLY-INSULATED MICRO-FABRICATED ATOMIC CLOCK STRUCTURE AND METHOD OF FORMING THE ATOMIC CLOCK STRUCTURE
STRUCTURE AND METHOD FOR FINFET DEVICE
ITC-IGBT AND MANUFACTURING METHOD THEREFOR
SEMICONDUCTOR DEVICES HAVING SELF-ALIGNED CONTACT PADS AND METHODS OF MANUFACTURING THE SAME
MEMORY DEVICE
PIXEL ARRAY OF AN IMAGE SENSOR AND IMAGE SENSOR
IMAGE SENSOR WITH DUAL LAYER PHOTODIODE STRUCTURE
THIN FILM TRANSISTOR ARRAY PANEL
ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE
THIN FILM TRANSISTOR ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF
SEMICONDUCTOR DEVICE, SWITCHING POWER SUPPLY CONTROL IC, AND SWITCHING POWER SUPPLY DEVICE
STRUCTURE AND METHOD OF PROVIDING A RE-DISTRIBUTION LAYER (RDL) AND A THROUGH-SILICON VIA (TSV)
TRANSISTORS WITH IMPROVED THERMAL CONDUCTIVITY