| 摘要 |
PROBLEM TO BE SOLVED: To obtain a pattern high in resolution and film endurance and superior in adhesion to a blocking resin and high in sensitivity to ultraviolet exposure by incorporating each specified amount of a specified polyamide and a specified sulfonate ester and a specified phenol compound. SOLUTION: This photosensitive resin composition contains 100 pts.wt. of the polyamide (A) represented by formula I, 1-50 pts.wt. of the 1,2- naphthoquinone-2-diazido-4-sulfate ester (B), 1-50 pts.wt. of the 1,2- naphthoquinone-2-diazido-5-sulfonnate ester (C) and 1-30 pts.wt. of the phenol compound (D) represented by formula II. In the formula I, X is a tetravalent cyclic group; Y is a divalent cyclic group; Z is represented by formula III; E is an aliphatic or cyclic group having an alkenyl or alkynyl group; each of (a) and (b) is a mol fraction and (n) is 2-500. In the formula II, each of R5 and R6 is an H atom or an alkyl group; and each of R7 -R10 is an H or halogen atom or the like. |
